The UNT Nanofabrication Cleanroom has a wide selection of processing tools, including dual e-Beam, thermal evaporation and sputtering systems for thin film development, and two RIE systems for metal and dielectric material etching of MEMS structures.
Sub-micron features are defined with a JEOL JSM-7001F SEM/EBL system with 3nm beam resolution and a Heidelberg DWL66fs maskless laser writer for photomask pattern writing. Four wet benches, HMDS 15 oven and spin coater hood with tabletop spin coater (Laurell WS-650Mz) are used for lithography process. For characterization analysis, the cleanroom is equipped with a J.A. Woolam M-2000V Ellipsometer and Nikon 66 microscope.
- AGS RIE MPS-150
- Heidelberg DWL 66 Maskless Lithography Laser Writer
- KLA-Tenco D300 profiler
- EVG 610 Mask Aligner
- JEOL JSM-7001F SEM and XENOS XPG 2 EBL pattern writer
- J.A. Woolam M-2000V Ellipsometer
- Nikon Optiphot 66 microscope
- Laurell WS-650Mz spin coater
- Oerlikon Sputtering and Ion Assist Ebeam deposition system
- Naomaster Dual Ebeam deposition system
- West Bond7476D wire bonder
- Trovato 300C organic deposition system
- Laurell chemical processing station WS-1000MH-CP7-D
- SCS 2010 Parylene labcote